Osprey™ CE alloys offer many advantages compared to most competitive materials. For example, CE alloys are lighter than competitive materials, such as:
- Aluminium alloys
- Aluminium silicon carbide (AlSiC)
- Iron nickel alloys (e.g. Kovar*, Alloy 49, F15)
- Titanium (Ti)
- Copper-molybdenum (Cu-Mo)
- Copper-tungsten (Cu-W)
- Steels
CE alloys also have controlled expansion coefficients at any preselected value in the range 5 to 17 ppm/°C.
The tables shows comparisons of CE alloys with other thermal management and packaging materials in terms of, for example, density, coefficient of thermal expansion, thermal conductivity and specific stiffness.
Competitive materials | Osprey™ CE alloys |
---|---|
Copper-85% tungsten (CuW) | CE7 uses significantly lower cost raw materials and is 1/6 the density. |
Copper-85% molybdenum (CuMo) | CE7 uses significantly lower cost raw materials and is 1/4 the density. |
Kovar* (FeNiCo) | CE7 and CE9 housings are comparable in price but are 1/3 the density and have 6–9 x thermal conductivity, eliminating the need for heat sinks. CE7/9 do not normally require heat treating and do not burr. |
Aluminium- silicon-carbide (AlSiC) | CE7 and CE9 do not require mould tools, thus prototypes can be delivered quickly and with much lower setting-up costs. CE7/9 are readily machinable and plateable. |
Beryllium-beryllium oxide (Be-BeO) | CE alloys are environmentally friendly and non-toxic. |
Titanium | CE9 or CE11 are 1/2 the density and have 6x the thermal conductivity. |
Aluminium alloys (e.g. 6061) | CE17 is 5% lighter, 30% stiffer and has a lower CTE than 6061 Al alloy, similar to many laminate board materials (e.g. FR4). CE17 is also less prone to burring. |
Copper | CE17 is 1/4 the weight, stronger and easier to machine. |
Steel | CE13/11 have similar CTEs but are 1/3 the density. |
Density
Osprey™ CE alloys are practically the lowest density, controlled expansion alloys commercially available and offer substantial weight advantages over most other regularly used materials such as CuW, CuMo, Kovar*, Ti, AlSiC and Al alloys.
Mechanical properties for CE alloys
Coefficient of thermal expansion
Osprey™ CE alloys exhibit a range of CTEs depending on Al and Si content. For example, CE7 (70% Si) matches the CTE of alumina, LTCC and GaAs; whilst CE17 (27% Si) matches the CTE of Cu and several laminate board materials.
Thermal properties for CE alloys
Thermal conductivity
Osprey™ CE alloys have much higher thermal conductivities than titanium and Kovar* and, therefore, housings can be manufactured without the need to include heat sinks.
Thermal properties for CE alloys
Specific stiffness
The high specific stiffness of controlled expansion alloys such as CE7 enables products to remain extremely flat during thermal cycling.
Mechanical properties for CE alloys
Alloy | CTE, ppm/ºC | Thermal, W/mK | Density, g/cc | Modulus, GPa | Yield, MPa |
---|---|---|---|---|---|
Al6061 | 22.6 | 210 | 2.7 | 70 | 140 |
Copper | 16 | 385 | 8.9 | 110 | 33 |
CE17 | 16.0 | 150 | 2.6 | 92 | 150 |
Steel | 12.2 | 52 | 7.8 | 200 | 180 |
Titanium | 8.9 | 17 | 4.5 | 116 | 140 |
CE11 | 11.0 | 150 | 2.55 | 110 | 150 |
Cu-4CuMo-Cu | 8.0–10.0 | 170 | 10.0 | 195 | 630 |
Al graphite | 7.5/23 | 190 | 2.5 | 89 | 160 |
CE7 | 7.2 | 120 | 2.5 | 125 | 110 |
Al SiC | 6.8 | 170 | 3.0 | 290 | 450 |
Cu 85% W | 6.8 | 180 | 16.4 | 360 | 1150 |
Cu 85% Mo | 6.8 | 165 | 10.0 | 310 | 1000 |
Kovar | 6.0 | 15 | 8.4 | 131 | 345 |
Molybdenum | 5.2 | 140 | 10.2 | 330 | 415 |
Alloy | Plateability | Machine | Welding | Forming |
---|---|---|---|---|
Al6061 | Good | Good | Good | Good |
Copper | Good | Good | Good | Good |
CE17 | Good | Good | Good | Good |
Steel | Good | Good | Good | Good |
Titanium | Fair | Fair | Fair | Good |
CE11 | Good | Good | Good | Poor |
Cu-4CuMo-Cu | Fair | Poor | Poor | Fair |
Al graphite | Poor | Good | Poor | Good |
CE7 | Good | Fair | Poor | Poor |
Al SiC | Poor | Poor | Poor | Poor |
Cu 85% W | Fair | Fair | Poor | Poor |
Cu 85% Mo | Fair | Fair | Poor | Poor |
Kovar | Good | Good | Good | Good |
Molybdenum | Fair | Poor | Poor | Poor |
* Kovar is a trademark of Carpenter Technology Corporation.